OPTOLINQ BMC-1100| Black Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features

Black
Excellent heat resistance
Long spiral flow

Product Description

OPTOLINQ BMC-1100 is a black epoxy molding compound specifically designed for the encapsulation of optoelectronic devices. With its high spiral flow, BMC-1100 exhibits outstanding moldability, which allows the precise and intricate molding of optoelectronic devices and ensures consistent and high-quality production.

This material also exhibits excellent thermal stability, meaning it can withstand high temperatures without significant degradation. Furthermore, its superior reliability ensures that the molded devices maintain their performance and functionality over extended periods, making it a highly dependable choice for optoelectronic applications.

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Black

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.9-2.1

Physical Properties

Spiral Flow @ 175°C

70-160 cm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	1500-2500 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	110 N/mm2

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C	70

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	10-20 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	30-50 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

150 °C

Additional Information

Processing Instructions

Before use, allow BMC-1100 to reach room temperature for a minimum of 8 hours, ensuring the bag remains unopened to prevent moisture contamination.
Apply an outer releasing agent, such as silicones or fluorinated compounds, to the mold surface to facilitate easy release from the mold dies.
Prior to molding with BMC-1100 or any new material, the mold should be cleaned thoroughly. For proper mold conditioning, the initial three shots should be cured for 5–10 minutes. After this initial conditioning period, you can reduce the curing time to a level that provides sufficient hot hardness for effective release.

Storage and Handling

OPTOLINQ BMC-1100 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment, ideally at –20°C or lower. The shelf life under this condition is 12 months.