OPTOLINQ TMC-3282SF | Transparent Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

OPTOLINQ TMC-3282SF | Transparent Mold Compound

Main features

Exceptional moldability with long spiral flow
Excellent performance at high temperature and high humidity conditions
Excellent adhesion and low stress

Product Description

OPTOLINQ TMC-3282SF is a high-performance optically clear epoxy molding compound specifically designed for the encapsulation of optoelectronic packages for automotive applications such as ambient light sensors and detectors. TMC-3282SF is a version with higher spiral flow, compared to the TMC-3282.

OPTOLINQ TMC-3282SF offers low moisture sensitivity maintaining performance even in high temperature and humidity conditions. TMC-3282SF stands out with its superior moldability and reliability, ensuring good quality and precision in optoelectronic device molding.

Key Features:

Low inner stress, strong adhesion and low moisture sensitivity
Superior process characteristics and high reliability
Durable Clarity
MSL 2 Capable

Product Family
TMC-3282SF

1. Select Pellet Weight

25 gr

2. Available Pellet Size

35 mm

3. Available Product Form

Pellet

4. Available Package Type

10kg box

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 8 - 12 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Transparent

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.24

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Physical Properties

Spiral Flow @ 175°C

100-240 cm

Mechanical Properties

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D)	80

Flexural Modulus
Flexural Modulus @ 25°C	3.7 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	130 N/mm2

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	62 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	183 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 160°C / 320°F	47.5 sec

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

165 °C

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F	150 s
Mold Temperature	160-175 °C
Preheat Temperature	85 °C

Post Mold Cure
Post Mold Cure @ 175°C / 347°F	4 hrs

Transfer Pressure

30-80 kg/cm2

Transfer Time

70 s

Additional Information

Processing Instructions

Before use, allow TMC-3282SF to reach room temperature (20±5 °C, 40±15% RH) for a minimum of 24 hours, ensuring the bag remains unopened to prevent moisture contamination.
After thawing, TMC-3283SF must be used within 8-12 hours.
For TMC-3282SF, preheating can be performed using standard RF equipment. Preheating must be done slowly to achieve uniform temperature.
Apply an outer releasing agent, such as silicones or fluorinated compounds, to the mold surface to facilitate easy release from the mold dies. Different curing conditions should be used depending on the mold design package, kind, and device type.
Prior to molding with TMC-3282SF or any new material, the mold should be cleaned thoroughly. To prepare the mold, the initial three shots should be cured for 5–10 minutes. After this initial preparation period, you can reduce the curing time to a level that provides sufficient hot hardness for effective release.

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.

Storage and Handling

OPTOLINQ TMC-3282SF is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment, ideally at –10°C or lower. The shelf life under this condition is 6 months.