PTM 5000-SP | Phase Change Paste

Harmonization Code : 8473.30.80.00 |   Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other
Main features
  • 0.06 - 0.08 Thermal Impedance
  • 3.5 - 4.5 Thermal Conductivity
  • Stencil Printable

Product Description

PTM5000-SP is Honeywell's thermally conductive phase change paste, which is available in Stencil printable form. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications.

PTM5000-SP has a Thermal conductivity of 3.5 - 4.5 (W/m·K) depending on the bondline thickness and is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08) , making it desirable for high-performance integrated circuit devices.

Product Family
PTM5000-SP  
1Kg Jar

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 2.3
Thickness range 0.20 - 1.00 mm
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 3.0x1015 Ohms⋅cm
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 3.5 - 4.5 W/m.K
Thermal Impedance 0.06 - 0.08 °C·cm²/W

Additional Information

When choosing a printable paste it is important to understand the process parameters and limitations.

That's why we ask, when you contact us, to include  the following information:

  1. What is your print thickness?
  2. How long is your printing time and working window?
  3. What is your drying step after printing?
    • Temperature (Room temperature or something else?)
    • Time 
  4. Do you have any viscosity limitations in the printing process?