PTM 7900-SP | Phase Change Paste

Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other

Main features

0.045 Thermal Impedance
8.0 Thermal Conductivity
Paste form

Product Description

PTM7900-SP is a viscous, stencil printable version of PTM7900 with identical properties. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. It has stable Thermal Impedance across accelerated aging tests and does not display bleed, pump or flow out. PTM7XXX product line has the highest Thermal conductivity and lowest thermal impedance out of the entire PTM Series

PTM7900-SP has a Thermal conductivity of 8.0 (W/m·K) depending on the bondline thickness and is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. This proprietary material provides superior reliability and maintains low thermal impedance (0.045) , making it desirable for high-performance integrated circuit devices. It has been qualified from major GPU and cooling solution manufacturers across the globe.

PTM7900-SP is almost as good as it gets. The only product that has slightly better thermal properties is PTM7950 which reaches 8.5 W/m·K and 0.04 TI and is designed for extremely demanding and tight applications.

Drying time

24 hours at Room temperature
Under 5 mins at 100°C

Product Family
PTM7900-SP

1. Select Package Type

1Kg Jar 300cc Al cartridge

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Shipping in 6 - 8 weeks

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties
Specific Gravity Specific Gravity Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.	2.8
Thickness range	0.20 - 1.00 mm
Electrical Properties
Volume Resistivity Volume Resistivity Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.	2.1x10¹⁴ Ohms⋅cm
Thermal Properties
Specific Heat Capacity Specific Heat Capacity Specific heat capacity is the amount of heat energy required to raise the temperature of a substance per unit of mass. The specific heat capacity of a material is a physical property. It is also an example of an extensive property since its value is proportional to the size of the system being examined.	0.97 J/(g⋅°C)
Thermal Conductivity Thermal Conductivity Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.	8.0 W/m.K
Thermal Impedance	0.046 °C·cm²/W

Additional Information

When choosing a printable paste it is important to understand the process parameters and limitations.

That's why we ask, when you contact us, to include the following information:

What is your print thickness?
How long is your printing time and working window?
What is your drying step after printing?
- Temperature (Room temperature or something else?)
- Time
Do you have any viscosity limitations in the printing process?