SAC387 | Pb-free Solder Spheres

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • Pb-free Solder Spheres
  • For BGA and CSP components
  • Tin/Silver/Copper alloys

Product Description

LINQALLOY SAC387 Solder Spheres are Pb-free Tin/Silver/Copper Sn95.5Ag3.8Cu0.7 Industry standard solder spheres for BGA and CSP components used by companies who have made the transition to Lead-free (Pb-free) soldering.

Furthermore, each jar has a clear label on the lid specifying the solder ball diameter as well as a label on the front identifying the alloy type, the quantity of spheres in the jar, the date of manufacture, and the product lot (or batch) number. This batch number is also tied to a certificate of conformance that is also provided with the solder spheres and ensures the SAC387 solder spheres meet the following quality criteria:

  • Tin (Sn): 95.5%
  • Silver (Ag): 3.8%
  • Copper (Cu): 0.7%
  • Melting Temperature (Solidus): 217°C
  • Melting Temperature (Liquidus): 219°C
  • Spheroid Tolerance : Within 1.5%

Diameter Tolerance

  • 0.075mm - 0.15mm (3-6 mils) : ±0.005mm (±0.2 mils)
  • 0.20mm - 0.60mm (8-24 mils) : ±0.010mm (±0.4 mils)
  • 0.65mm - 0.76mm (25-30 mils) : ±0.015mm (±0.6 mils)
Product Family
SAC387  
0.457 mm 0.500 mm
250 kpcs/jar

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Alloy Composition
Alloy Composition
Composition of the alloy material
 Sn95.5Ag3.8Cu0.7
Alloy Type
Alloy Type
A metallic element type
 SAC387
Spheroid Tolerance
Spheroid Tolerance
The allowed % that a solder ball (solder sphere) can divert from being perfectly round and spherical.

We take one lot of solder spheres and divide it into 4 smaller lots. Each lot is then checked with advanced visual inspection systems. If even 1 ball is out of spec, the entire batch is scrapped and reworked!
 1.5 %
Metal Loading
Copper (Cu)
Copper (Cu)
Copper is a soft malleable and ductile metal with a very high thermal and electrical conductivity.
 0.7 %
Silver (Ag) 3.8 %
Tin (Sn) 95.5 %
Thermal Properties
Melting Temperature
Liquidus Melting Temperature
Liquidus Melting Temperature
Liquidus, is the temperature point at which an alloy becomes completely liquid.
 219 °C
Solidus Melting Temperature
Solidus Melting Temperature
Solidus is the temperature point at which a completely solid alloy starts melting and becoming softer.
 217 °C
Other Properties
RoHS Compliant
RoHS Compliant
RoHS is a product level compliance based on a European Union Directive which restricts the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).

Products compliant with this directive do not exceed the allowable amounts of the following restricted materials: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), with some limited exemptions
 Yes

Additional Information

 

What do I get when I buy SAC387 Solder Spheres from CAPLINQ?

The advantage of ordering solder spheres online at CAPLINQ.com is that you can be sure of the quality. The solder spheres you receive are originally manufactured solder spheres packed into jars with inert gas (nitrogen). We do not repack the solder balls we receive, so the jars you will receive have never been opened, thus ensuring the quality of the product you receive. The lid of the jar is also always sealed with a shrink-wrapped plastic wrap ensuring that the solder spheres do not oxidate in the jar.