The dicing process is an intricate and crucial step during semiconductor manufacturing. During the dicing process, a high-speed saw (or laser) cuts through the wafer, cutting it into smaller pieces called dies. 

The first part of the process is to mount the wafer to a stand with a dicing tape. Then, the wafer can be separated into dies. There are multiple methods to do this, but the most popular are blade or laser dicing.

Blade Dicing

The blade dicing method consists of a fast-moving, diamond coated blade that very quickly slices through the wafer. The cuts are extremely precise and smooth. Even though the process is very efficient, its main disadvantage comes to play with thinner and more fragile wafers. The blade can cause mechanical stress and chipping.

Laser Dicing

Laser dicing is a no-contact method of slicing the wafer. It uses laser technology to quickly cut the wafer into dies and is great for thin, fragile wafers that are complex. It is higher precision compared to blade dicing and reduces the mechanical stress that comes into play with the contact of the blade and the wafer. It also has less debris than the blade dicing process. However, it is a more expensive investment and, in some cases, can cause heat damage to the wafer. 

One of the most critical components during both the blade and laser dicing processes are dicing tapes. Dicing tapes are specialized tapes designed for use during the dicing process. They are thin, flexible, and have a strong adhesion layer.

The tape's main goals are to:

• Support the wafer - the tape holds the wafer securely, which means it won't move and thus won't be damaged by the blade during the cutting process.
• Be easily removable - since the tape isn't a part of the final component, it needs to be removed. After the removal of the tape the individual dies must remain intact and free of any residue.

 

 

UV Removable vs Non-UV Removable Dicing Tapes

UV Removable Dicing Tapes are widely used in dicing tapes to prevent the adhesion of residue to the wafer. When UV Light is applied, the adhesive becomes less tacky and allows for easy removal. This works because of the adhesive. The adhesive used is sensitive to UV light, and when exposed to it, it chemically alters to lose its bonding strength. One of the most important qualities of this technology is that no residue is left on the substrate. This makes it ideal for wafers.

Non-UV Removable Dicing Tapes are removed the traditional way. They are also specifically designed to leave no residue behind, however are more challenging to remove than a UV Removable Tape. They can be used in applications in which a consistent level of adhesion is needed. Non-UV Removable is a more economical option and is ideal for very fragile and thin dies that require strong adhesion throughout the entire process. 

UV Removable Dicing Tapes need to meet these two performance requirements:

Questions to ask when Choosing a Dicing Tape

 

LINQSTAT DICING Tapes for Semiconductor Wafers 

Since the dicing process is an extremely sensitive application, the tapes require specialized materials. LINQSTAT PET, Polyolefine, and Polymerized Vinyl Chloride Dicing Tapes are designed specifically to meet these needs, offering excellent mechanical strength and high adhesion without residue.

LINQSTAT DCT-PET115 is a transluscent polyethylene terephthalate (PET) tape designed for the dicing process. It provides an excellent balance of electrical, mechanical, thermal, and chemical properties.

LINQSTAT Polyolefin Dicing Tapes feature the same strong adhesion as the PET Series but are more easily removed from the substrate. This makes it ideal for applications such as packaging substrates or delicate substrates where gentler adhesion is required for easier removal. Polyeolefin Dicing tapes are available in two thicknesses, 165 μm (DCT-PO165) and 200 μm (DCT-PO200)

LINQSTAT Polymerized Vinyl Chloride Dicing Tapes offer superior mechanical strength and excellent adhesion while being easy to remove without residue. These tapes are transparent, UV Removable, and ideal for high-precision applications. PVC Dicing Tapes are available in 80 μm (DCT-PVC80NUV), and 95 μm (DCT-PVC95) thicknesses.