LINQALLOY SP-PSA525 | Solder Paste

Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

Main features

High thermal fatigue resistance for power semiconductor applications
Reliable clog-free dispensing
Superior wetting

Product Description

LINQALLOY SP-PSA525 is a high-lead solder paste composed of 5% Sn, 92.5% Pb, and 2.5% Ag. It has been designed for die attach processes which gives reliable clog-free dispensing of consistent deposits in terms of viscosity and particle size in the automated dispensing equipment. Using high-temperature alloys, this product is able to give superior wetting capabilities and gives high solder joint strength. This solder paste is suitable for power semiconductor die attach applications.

LINQALLOY SP-PSA525 solder paste is being offered as a no-clean solder paste. No-clean solder paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues.

Product Family
SP-PSA525

1. Select Alloy Type

Pb92.5Sn5Ag2.5

2. Available Package Type

30cc syringe 500g jar

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Shortest leadtime

Contact for Pricing

Packaging

TDS, SDS & Technical documents

Specifications
Additional Information

Technical Specifications

General Properties

Alloy Type

Alloy Type
A metallic element type

Pb92.5Sn5Ag2.5

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days