TC-8020LS | Clear Optical Molding Compound

Harmonization Code : 3907.30.00.15 |   Epoxide resin, halogen-free
Main features
  • LED Encapsulation
  • Low stress
  • Better reflow and Thermal shock

Product Description

TC-8020-LS is a high-performance optical solid epoxy specifically developed for LED encapsulation. This monocomponent epoxy achieves superior adhesion performance and great transmittance. It has lower Tg than the "normal" 8020 version.

TC-8020-LS is able to offer low blue-ray decay for outdoor LED applications and overall great light performance. This low stress white epoxy is very close to competitive solutions such as XX814, XX1000 and XX97. It is a reliable product that has improved reflow abilities and thermal shock test performance.

Product Family
TC8020LS  
10Kg Box
450 nm
35 mm
25 gr

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Appearance
Appearance
Appearance at room temperature.
 Blue Tablet
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.2
Physical Properties
Spiral Flow @ 175°C 150 - 250 cm
Chemical Properties
Water Absorption 0.17 %
Mechanical Properties
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D) 83
Flexural Modulus
Flexural Modulus @ 25°C 3100 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 110 N/mm2
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 70 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 220 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 160°C / 320°F 20 - 40 sec
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 95 °C
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Time 3 - 5 min
Mold Temperature 140 - 160 °C
Preheat Temperature 40 - 80 °C
Post Mold Cure
Post Mold Cure @ 150°C / 302°F 4 - 6 hrs
Transfer Pressure 10 - 40 kg/cm2
Transfer Time 20 - 50 s

Additional Information

 
 TC-8020 Low Stress Products Properties Comparison
 
PROPERTY UNIT TC-8020L TC-8020LS
Viscosity  cP 300 200
Spiral Flow @150°C cm 150-250 150-250
Hot Plate Gel Time @150°C sec 25-50 20-50
Glass Transition Temperature °C 115 95

CTE by TMA, α1

CTE by TMA, α2

ppm

ppm

70

170

70

220

Moisture Absorption PCT

24 hrs @25°C water

24 hrs @121°C, 2atm, 100%RH

 

wt%

wt%

 

0.16

3.2

 

0.17

3.8

Flexural Strength @25°C

Flexural Modulus @25°C

MPa

Mpa

130

2900

110

3100

yellowing Δb - 4 hrs @200°C

yellowing Δb - 30 min @280°C

yellowing Δb - 4 hrs UV

 -

8

42

16.5

25

45

16.5
Transmittance 1mm @450nm % >90 >90
Refractive Index @633nm - 1.56 1.56
Comment   Low stress version for better reflow performance Low stress for balanced reflow and thermal shock test performance