TC-8020T | Optically Clear Molding Compound

Harmonization Code : 3907.30.00.15 |   Epoxide resin, halogen-free
Main features
  • LED Encapsulation
  • Optically clear
  • Emitter and Detector encapsulation

Product Description

TC-8020T is a high transmission, one component, optically clear epoxy molding compound that is specifically developed for emitter and LED encapsulation. Its excellent fluidity design aids it to become easily mouldable and processable while offering excellent package performance and durability. This is supported by its long term transmittance and post reflow reliability.

TC-8020T is a single component epoxy with superior adhesion performance, transmittance and stability at high temperatures. It is mainly utilised to package single color (monochrome) LEDs, 7-segment LED displays, compact LED indicators, monochrome ChipLEDs and photo-links.It offers good adhesion to Bismaleimide Triazine - BT substrates and metal leadframes, good flexural modulus, and excellent anti-reflow performance while also passing the stringent MSL 3/2A JEDEC requirements. Check TC-8020T Internal Reliability Test Results. 

Typical Applications

  • Low-Power LED & Emitters
  • Pulse Oximeter Sensors
  • Ambient Light Sensors
  • IR and Near-IR Sensors
  • Data transmission and industrial fibers.

Versions Available

Comparable With: XX-18, XX-8524, XX-330H

 

Product Family
TC8020T  
10Kg Box 7Kg Box
450 nm 800 nm 840 nm
13 mm 16 mm 14 mm 35 mm
2.9 gr 2.5 gr 3.2 gr 25 gr 22.5 gr 3.8 gr

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Refractive index
Refractive index
The refractive index determines how much the path of light is bent, or refracted, when entering a material. It is calculated by taking into account the velocity of light in vacuum compared to the velocity of light in the material.

The refractive index calculation can be affected by the wavelength of light and the temperature of the material. Even though it is usually reported on standard wavelengths it is advised to check the TDS for the precise test parameters.
 1.56
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.23
Physical Properties
Spiral Flow @ 175°C 150 - 250 cm
Chemical Properties
Moisture absorption 0.45 %
Water Absorption 0.17 %
Mechanical Properties
Hardness
Hardness
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore A) 75
Durometer (Shore D) 86
Molded Shrinkage 1.6 %
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 70 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 170 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 160°C / 320°F 20 - 40 sec
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Cure Time 3 - 5 min
Mold Temperature 140 - 160 °C
Preheat Temperature 40 - 80 °C
Post Mold Cure
Post Mold Cure @ 150°C / 302°F 4 - 6 hrs
Transfer Pressure 10 - 40 kg/cm2
Transfer Time 20 - 50 s

Additional Information

 

TC8020 Series Product Properties Comparison

 
PROPERTY UNIT TC-8020T TC-8020L TC-8020LS TC-8020T-SR
Viscosity  cP 300 300 200 300
Spiral Flow @150°C cm 150-250 150-250 150-250 150-250
Hot Plate Gel Time @150°C sec 20-40 25-50 20-50 20-40
Glass Transition Temperature °C 125 115 95 125

CTE by TMA, α1

CTE by TMA, α2

ppm

ppm

70

170

70

170

70

220

70

170

Moisture Absorption PCT

24 hrs @25°C water

24 hrs @121°C, 2atm, 100%RH

 

wt%

wt%

 

0.17

3.2

 

0.16

3.2

 

0.17

3.8

 

0.17

3.2

Flexural Strength @25°C

Flexural Modulus @25°C

MPa

Mpa

130

3000

130

2900

110

3100

130

3000

yellowing Δb - 4 hrs @200°C

yellowing Δb - 30 min @280°C

yellowing Δb - 4 hrs UV

 -

5

33

11

8

42

16.5

25

45

16.5

5

37

11
Transmittance 1mm @450nm % >90 >90 >90 >90
Refractive Index @633nm - 1.56 1.56 1.56 1.56
Comment   Standard Item for through-hole and surface mount component Low stress version for better reflow performance Low stress for balanced reflow and thermal shock test performance Self-release technology without compromising key properties
 

TC-8020T DSC & DMA Data 

TC-8020L/LS shows lower modulus at 150℃ and -50℃, which improves performance in thermal cycling and thermal shock tests.

TC8020T DSC CurveTC-8020T DSC Curve
TC-8020 DMA Storage ModulusTC-8020T DMA Data Curve
 

TC-8020T Optical Filter Choice

Transmittance wavelength window could be adjusted according to customers' specifications.

TC-8020 Cutoff Filter Versions Transmittance DataTransmittance Curve: TC-8020T Cutoff Filter 1mm
TC-8020 Bandpass Filter TransmittanceTransmittance Curve: TC-8020T Bandpass Filter 0.4mm

TC-8020T Reliability Test Results

 
Tests Test Conditions Electrical Test Yellowing
High Temperature Storage 200°C * 4 hr Pass Δb < 4.5
UV Exposure 25w * 1 hr @340nm Pass Δb < 12.0
Reflow 10 x 30 sec @ 260°C, IR reflow Pass Δb < 35.0
3 x 30 sec @ 260°C, IR reflow after 6 hrs' storage @85 °C and 85% RH Pass -
Thermal Shock 15 mins@-40°C ~ 15mins@100°C, 300 cycles Pass -
Red Dye Penetration PCT, 12 hrs @121°C Pass -
Double 85 168 hrs @85°C and 85% RH Pass -
High Temperature Storage 125°C * 500 hrs Pass -
HAST HAST 110; HAST 130 Pass -