OPTOLINQ BMC-4200| Opaque Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Main features

Opaque
Suitable spiral flow for molding conditions
Superior reliability

Product Description

OPTOLINQ BMC-4200 is a Series of Opaque molding compounds used as encapsultation of optoelectronic devices. It exhibits excellent moldability under suitable spiral flow conditions.

This material exhibits excellent thermal stability, meaning it can withstand high temperatures without significant degradation. Additionally, it possesses outstanding mechanical processing performance, making it easily moldable and shapeable during manufacturing.

The material's remarkable moldability allows for precise and intricate molding of optoelectronic devices, ensuring consistent and high-quality production. Furthermore, its superior reliability ensures that the molded devices maintain their performance and functionality over extended periods, making it a highly dependable choice for optoelectronic applications.

Molding information

OPTOLINQ BMC-4200 differs from other molding compounds and has some special procedures required.

Temperature recovery

OPTOLINQ BMC-4200 must first be allowed to achieve room temperature (20±5°C , 40±15% RH) for atleast 24 hours (Big size) and 12 hours (Small size), without opening the bag before using it, to avoid contamination.

Preheat

Preheating of OPTOLINQ BMC-4200 can be done by using standard RF equipment. The preheating should be done slowly to achieve uniform temperature.

Specifications

Technical Specifications

General Properties

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

1.22

Physical Properties

Spiral Flow @ 175°C

80-240 cm

Mechanical Properties

Flexural Modulus
Flexural Modulus @ 25°C	3000-3500 N/mm2

Flexural Strength
Flexural Strength @ 25°C Flexural Strength @ 25°C Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C	120 N/mm2

Hardness Hardness Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Hot Hardness, Shore D @ 175°C	80

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	40-80 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	150-210 ppm/°C

Gel Time Gel Time Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable. It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F	20-50 s

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

115 °C

Curing Conditions

Curing Schedule Curing Schedule Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV. Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure. There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure. Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 175°C / 347°F	150-240 s
Mold Temperature	150-170 °C
Preheat Temperature	75-95 °C